PK136 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 10.8689g

PK136 (v1.3) July 20, 2010
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Organopolysiloxane
mixture
Copper
Nickel
Gold
Glass fiber
Halogen fire
retardant
BT (core)
Solder mask
Tin
Lead
100% Material Declaration Data Sheet
FF1148
CAS Number
or
Description
Percentage of
Component
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
NA
100.00
63.00
37.00
70.00
20.00
3.00
7.00
99.90
0.10
100.00
7440-50-8
7440-02-0
7440-57-5
NA
NA
NA
NA
7440-31-5
7439-92-1
47.52
0.52
0.11
10.35
5.30
27.50
8.70
63.00
37.00
Average Weight: 10.8689g
Use in
Product
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
0.694500
6.390
0.694500
0.036115
0.332
0.022753
0.013363
0.074000
0.681
0.051800
0.014800
0.002220
0.005180
6.000000
55.203
5.994000
0.006000
0.130000
1.196
0.130000
Metal layer
Metal layer
Metal layer
2.975310
1.390779
0.014877
0.003273
0.309432
0.156085
27.375
0.833087
0.267778
0.959000
0.60417
0.35483
8.823
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countries. All other trademarks are the property of their respective owners.
PK136 (v1.3) July 20, 2010
www.xilinx.com
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