PK134 Datasheet, PDF (1/4 Pages) –

PK134 (v1.6) March 11, 2011
100% Material Declaration Data Sheet FF672
Component
Silicon Die
(FPGA)
Solder Bump
Die Underfill
Solder Paste
Substance
Description
Doped silicon
Tin
Lead
Bisphenol F-type
liquid epoxy resin
Phenolic resin
Bisphenol A-type
liquid epoxy resin
Amine type
accelerator
Silicon dioxide
Carbon black
Additives
Tin
Silver
Copper
CAS Number
or
Description
Percentage
of
Component
7440-21-3
7440-31-5
7439-92-1
9003-36-5
Trade secret
25068-38-6
Trade secret
60676-86-0
1333-86-4
Trade secret
7440-31-5
7440-22-4
7440-50-8
100.00
63.00
37.00
20.00
15.00
5.00
5.00
51.50
1.00
2.50
96.50
3.00
0.50
Average Weight: 6.5771 g
Use in Product
Silicon IC
Die to package
Basis
Component Weight/
Substance Weight
(grams)
0.443503
0.443503
0.024729
0.015580
0.009150
0.056000
0.011200
Component
Percent of Total
6.743
0.376
0.851
Basis
0.008400
Basis
0.002800
Basis
Basis
Basis
Additive
Basis
Basis
Basis
0.002800
0.028840
0.000560
0.001400
0.048000
0.046320
0.001440
0.000240
0.730
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PK134 (v1.6) March 11, 2011
www.xilinx.com
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