PK133 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :4.9062g

100% Material Declaration Data Sheet for FF668
PK113 (v1.5) Suptember 20, 2016
Component
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader Adhesive
Solder Ball
Substrate
Substance Description
CAS # or Description
Average Weight :
4.9062
g
% of Component Use in product Component Weight Component % of total
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Zinc oxide
Other
Tin
Lead
Copper
Tin
Lead
Silver
BT (Core)
ABF
Solder Mask
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
1314-13-2
Trade Secret
7440-31-5
7439-92-1
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
100.000
63.000
37.000
70.000
20.000
3.000
7.000
99.900
0.100
35.000
65.000
63.000
37.000
44.28
1.01
0.14
0.02
39.72
10.67
4.16
Silicon IC
Base metal
Base metal
Base metal
Base metal
Base metal
Base metal
Base metal
Base metal
0.430700
0.430700
0.021443
0.013509
0.007934
0.044000
0.030800
0.008800
0.001320
0.003080
3.000000
2.997000
0.003000
0.032500
0.011375
0.021125
0.558020
0.351553
0.206467
0.819560
0.362901
0.008278
0.001147
0.000164
0.325529
0.087447
0.034094
8.780%
0.440%
0.900%
61.150%
0.660%
11.370%
16.700%
Revision History
The following table shows the revision history for this document.
Date
3/23/06
7/5/06
7/27/06
9/27/06
7/20/10
9/20/16
Version
1.0
1.1
1.2
1.3
1.4
1.5
Description of Revisions
Initial Xilinx release.
100% Material Declaration.
Corrected heat Spreader Adhesive Component Weight and Component % of total.
Updated component descriptions.
Updated heat Spreader substance description.
Updated Substrate substances description and weight.
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or
completeness, including, but not limited to, with respect to its compliance with applicable environmental
laws and regulations. Xilinx subcontracts the production, test and assembly of hardware devices to
independent third-party vendors and materials suppliers (“Contractors”). All data provided hereunder is
based on information received from Contractors. Xilinx has not independently verified the accuracy or
completeness of this information which is provided solely for your reference in connection with the use
of Xilinx products.
© Copyright 2016 Xilinx