PK132 Datasheet, PDF (1/3 Pages) –

PK132 (v4.0) December 23,
2011
100% Material Declaration Data Sheet VOG48
Pure Tin Leads*
*Xilinx Platform Flash PROM VOG48 with datecode prior to 1030 will have Matte Tin (Sn) Lead-frame plating finish
Average Weight: 0.520 g
Component
Silicon die
Substance
Description
CAS# or
Description
% of
Component
Use in Product
Component Weight/
Substance Weight
(in grams)
0.003864
Component %
of Total
0.743%
Lead-frame
alloy
Lead-frame
plating
Die Attach
Material
Gold Wire
Mold
Compound
Encapsulation
Silicon
Aluminium (Al)
Copper (Cu)
Titanium
Copper (Cu)
Iron (Fe)
Zinc (Zn)
Iron Phosphide
(FeP)
Silver (Ag)
Tin (Sn)
Silver
Bismaleimide and
acrylate polymer
Acrylate monomer
Gold
Epoxy Resin
Phenol Resin
Silicon Dioxide
Carbon Black
7440-21-3
7429-90-5
7440-50-8
7440-32-6
7440-50-8
7439-89-6
7440-66-6
26508-33-8
7440-22-4
7440-31-5
7440-22-4
Trade Secret
Trade Secret
7440-57-5
Trade Secret
Trade Secret
60676-86-0
1333-86-4
99.70
0.20
0.05
0.05
97.25
2.35
0.12
0.08
0.20
100.00
79.00
14.00
7.00
100.00
8.00
8.00
83.50
0.50
0.003850
0.000010
0.000002
0.000002
0.109060
0.106060
0.002560
0.000130
0.000090
0.000220
0.003140
0.003140
0.000760
0.000600
0.000110
0.000050
0.000670
0.000670
0.402500
0.032200
0.032000
0.336090
0.002010
20.973%
0.604%
0.146%
0.129%
77.404%
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK132 (v4.0) December 23, 2011
www.xilinx.com
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