PK131 Datasheet, PDF (1/1 Pages) –

100% Material Declaration Data Sheet for VOG20
PK131 (v1.3) Apr 22, 2016
Component
Die
Die Attach
Bonding Wire
Molding Compound
Ext. Plating
Lead-frame alloy
Leadframe Plating
Average Weight :
0.086000
g
Substance Description
Silicon (Si)
CAS # or Description
7440-21-3
% of component
100.00
Use in product Component weight
0.004016
Silicon IC
0.004016
0.000714
gamma-butyrolactone
Phenol-formaldehyde
polymer
Phenolic epoxy resin F-
44
silver
96-48-0
9003-35-4
9003-36-5
7440-22-4
3.00
3.00
22.00
72.00
Attach
Attach
Attach
Attach
0.000021
0.000021
0.000157
0.000514
0.000172
Gold (Au)
7440-57-5
100.00
Wire
0.000172
4,4'-Dihydroxy-3,3',5,5'-
tetramethyldiphenylmetha
ne diglycidyl ether
aluminium hydroxide
Benzaldehyde, hydroxy-,
polymer with phenol
Carbon black
Silica, vitreous
Tin (Sn)
Copper (Cu)
Iron (Fe)
Phosphorus
Zinc (Zn)
Silver
93705-66-9
21645-51-2
106466-55-1
1333-86-4
60676-86-0
7440-31-5
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
8.00
3.00
5.00
1.00
83.00
100.00
97.40
2.30
0.10
0.20
100.00
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Base metal
Base metal
Base metal
Base metal
Base metal
Base metal
0.056622
0.004530
0.001699
0.002831
0.000566
0.046997
0.000198
0.000198
0.023676
0.023060
0.000545
0.000024
0.000047
0.000602
0.000602
Component % of total
4.67%
0.83%
0.20%
65.84%
0.23%
27.53%
0.70%
Revision History
Date
3/21/2006
07/10/2006
9/29/2006
04/22/2016
Version
1.0
1.1
1.2
1.3
Description of
Revisions
Initial Xilinx release
100% Material
Declaration
Updated component
descriptions
Update mold compound
& silver epoxy material
Notice of Disclaimer
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its accuracy or completeness, including, but not limited to, with respect to its
compliance with applicable environmental laws and regulations. Xilinx
subcontracts the production, test and assembly of hardware devices to
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data provided hereunder is based on information received from Contractors.
Xilinx has not independently verified the accuracy or completeness of this
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