PK130 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.5392 g

100% Material Declaration Data Sheet for
VQG100 Package
PK130 (v1.5) April 26, 2013
Component
Silicon Die
Die Attach
Mold
Compound
Leadframe
Solder Plating
Gold Wire
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon (Si)
7440-21-3
Silver (Ag)
Epoxy Resin
Anhydride
1,4-
Butanedioldiglycid
yl ether
7440-22-4
Trade Secret
Trade Secret
2425-79-8
Epoxy Resin
Phenol Resin
Carbon Black
Fused Silica
Trade secret
Trade secret
1333-86-4
60676-86-0
Copper (Cu)
Chromium (Cr)
Tin (Sn)
Zinc (Zn)
Silver (Ag)
Tin (Sn)
Gold (Au)
Palladium
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
7440-31-5
7440-57-5
7440-05-3
100.00
72.00
15.00
10.00
3.00
7.00
5.00
0.30
87.70
98.28
0.25
0.25
0.22
1.00
100.00
99.00
1.00
Average Weight: 0.5392 g
Use in Product
Component Weight/
Substance Weight
(grams)
Component
Percent of
Total
0.017360
0.017360
0.025760
0.018547
0.003864
0.002576
3.220
4.778
0.000773
0.347130
0.024299
0.017357
0.001041
0.304433
0.140910
0.138486
0.000352
0.000352
0.000310
0.001409
0.005910
0.005910
0.002100
0.002079
0.000021
64.382
26.135
1.096
0.389
© Copyright 2006-2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective owners
PK130 (v1.5) April 26, 2013
www.xilinx.com
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