PK127 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.776259 g

PK127 (v1.2) September 28, 2006
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Bond Wire
Ext. Plating
Silicon
7440-21-3
anhydride
Silver
Epoxy resin
Trade Secret
7440-22-4
Trade Secret
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Copper
Magnesium
Nickel
Silicon
7440-50-8
7439-95-4
7440-02-0
7440-21-3
Gold
7440-57-5
Tin
7440-31-5
100% Material Declaration
Data Sheet
TQG176
Material Declaration Data Sheet
% of
Component
100.00
Average Weight: 1.776259 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.02752
0.02752
0.003709
Component %
of Total
1.55%
0.21%
7.50
77.50
15.00
0.000278175
0.002874475
0.00055635
1.465
82.48%
7.00
5.00
0.30
87.70
94.3
0.30
1.2
4.2
100.00
100.00
0.10255
0.07325
0.004395
1.284805
0.2601
0.2452743
0.0007803
0.0031212
0.0109242
0.00393
0.00393
0.016
0.016
14.64%
0.22%
0.90%
PK127 (v1.2) September 28, 2006
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