PK126 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.4 g

PK126 (v1.2.1) October 19, 2006
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Silicon
7440-21-3
Silver
Epoxy (EP)
7440-22-4
Trade Secret
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Bismuth
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
100% Material Declaration
Data Sheet
TQG144
Material Declaration Data Sheet
% of
Component
100.00
78.00
22.00
9.00
7.00
0.50
82.50
Max 1.00
Use in Product
Average Weight: 1.4 g
Component Weight/
Substance Weight
(in grams)
0.0147
0.0147
0.00224
Component %
of Total
1.05%
0.16%
0.0017472
0.0004928
1.10208
78.72%
0.0991872
0.0771456
0.0055104
0.909216
0.0110208
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Copper
Chromium
Tin
Zinc
Silver
Gold
Tin
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
7440-57-5
7440-31-5
98.85
0.30
0.25
0.60
100.00
100.00
100.00
0.26124
0.25823574
0.00078372
0.0006531
0.00156744
0.00112
0.00112
0.00616
0.00616
0.01246
0.01246
18.66%
0.08%
0.44%
0.89%
PK126 (v1.2.1) October 19, 2006
www.xilinx.com
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