PK124 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 7.1 g

PK124 (v1.2.1) October 19, 2006
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Heatspreader
Ext. Plating
Silicon
7440-21-3
Silver
Epoxy (EP)
7440-22-4
Trade Secret
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Bismuth
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Copper
Chromium
Tin
Zinc
7440-50-8
7440-47-3
7440-31-5
7440-66-6
Silver
Gold
Alumiuim
Tin
7440-22-4
7440-57-5
7429-90-5
7440-31-5
100% Material Declaration
Data Sheet
PQG240
Material Declaration Data Sheet
% of
Component
100.00
Use in Product
Average Weight: 7.1 g
Component Weight/
Substance Weight
(in grams)
0.08023
0.08023
0.01065
Component %
of Total
1.13%
0.15%
78.00
22.00
0.008307
0.002343
5.72828
80.68%
9.00
7.00
0.50
82.50
Max 1.00
98.85
0.30
0.25
0.60
0.5155452
0.4009796
0.0286414
4.725831
0.0572828
0.79236
0.78324786
0.00237708
0.0019809
0.00475416
0.00497
11.16%
0.07%
100.00
100.00
100.00
100.00
0.00497
0.0128
0.0128
0.42813
0.42813
0.0426
0.0426
0.18%
6.03%
0.60%
PK124 (v1.2.1) October 19, 2006
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