PK120 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 15.35571 g

PK120 (v1.2) September 28, 2006
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Heat Slug
Ext. Heat Sink
plating
Bond Wire
Ext. Plating
Silicon
Silver
Epoxy (EP)
Epoxy Resin (EP)
Silica
Copper
Chromium
Tin
Zinc
Silver
Copper
Nickel
Gold
Tin
7440-21-3
7440-22-4
Trade Secret
Trade Secret
60676-86-0
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
7429-50-8
7440-02-0
7440-57-5
7440-31-5
100% Material Declaration
Data Sheet
HQG240
Material Declaration Data Sheet
% of
Component
100.00
Average Weight: 15.35571 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.22748
0.22748
0.01916
Component %
of Total
1.48%
0.12
75.00
25.00
0.014368
0.004789
3.96134
25.80%
16.00
84.00
99.25
0.30
0.25
0.20
0.633815
3.327527
0.53985
0.535804
0.001620
0.001350
0.001080
0.00161
3.52%
0.01%
100.00
100.00
0.00161
10.54917
10.54917
0.00706
68.70%
0.05%
100.00
100.00
100.00
0.00706
0.00826
0.00826
0.04178
0.04178
0.05%
0.27
PK120 (v1.2) September 28, 2006
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