PK119 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 10.943 g

PK119 (v1.2) September 28, 2006
100% Material Declaration
Data Sheet
HQG208
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Heat Sink
Ext. Heat Sink
Plating
Bond Wire
Ext. Plating
Silicon
Resin
Silver
Epoxy Resin (EP)
Silica
Copper
Chromium
Tin
Zinc
Silver
Copper
Nickel
Gold
Palladium
Tin
7440-21-3
Trade Secret
7440-22-4
Trade Secret
60676-86-0
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
7440-50-8
7440-02-0
7440-57-5
7440-05-3
7440-31-5
% of
Component
100.00
Average Weight: 10.943 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.16981
0.169814
0.01531
Component %
of Total
1.55%
0.14%
25.00
75.00
0.003828
0.011483
3.24216
29.63%
16.00
84.00
99.25
0.30
0.25
0.20
0.518746
2.723414
0.37676
0.373939
0.001130
0.000942
0.000754
0.001560
3.44%
0.01%
100.00
100.00
0.001560
7.08725
7.08725
0.00547
64.76%
0.05%
100.00
99.04
0.9500
100.00
0.005471
0.01153
0.011417
0.000110
0.03346
0.03346
0.11%
0.31%
PK119 (v1.2) September 28, 2006
www.xilinx.com
1
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