PK118 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.528 g

PK118 (v1.3) November 12, 2013
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Silicon
7440-21-3
Resin
Silver
Metal Oxide
Amine
Gamma
Butyrolactone
Trade Secret
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Resin Type Ortho
Cresol Novolac
SiO2
Trade Secret
60676-86-0
Copper
Iron
Phosphorus
Zinc
7440-50-8
7439-89-6
7723-14-0
7440-66-6
Silver
Gold
Tin
7440-22-4
7440-57-5
7440-31-5
100% Material Declaration
Data Sheet
PDG8
Material Declaration Data Sheet
% of
Component
100.00
Average Weight: 0.528 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.006650
0.006653
0.001980
Component %
of Total
1.26%
0.37%
21.00
70.00
3.00
3.00
3.00
0.000415
0.001383
0.000059
0.000059
0.000059
0.318240
60.31%
13.50
0.042962
86.50
97.50
2.35
0.03
0.12
0.275278
0.189840
0.185099
0.004461
0.000057
0.000228
0.001350
35.98%
0.26%
100.00
100.00
100.00
0.001350
0.000410
0.000414
0.009160
0.009164
0.08%
1.74%
PK118 (v1.3) November 12, 2013
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1
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