PK117 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 7.248 g

PK117 (v1.2) September 28, 2006
100% Material Declaration
Data Sheet
PCG84
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
% of Component
Silicon Die
Die Attach Material
Mold Compound
Leadframe
Leadframe Plating
Bond Wire
Ext. Plating
Silicon
Resin
Trade Secret
Silver
7440-22-4
Zirconium
Trade Secret
Mixed aryl allyl
glycidyl compounds
Trade Secret
Amine
Trade Secret
Gamma Butyrolaclone Trade Secret
Diglycidylether of
bisphenol-F
Trade Secret
Epoxy Resin (EP)
Trade Secret
Silica
60676-86-0
Carbon Black
1333-86-4
Epoxy Cresol Novolac Trade Secret
Phenolic Resin
Trade Secret
Copper
Zirconium
7440-50-8
7440-67-7
Silver
7440-22-4
Gold
Silver
Copper
7440-57-5
7440-22-4
7440-50-8
Tin
7440-31-5
100%
7.00
70.00
0.10
3.00
5.00
5.00
10.00
7.50
86.00
0.50
2.00
4.00
99.90
0.10
100.00
99.99
0.0005
0.0022
100.00
Average Weight: 7.248 g
Use in
Product
Component Weight/
Substance Weight
(in grams)
0.02369
0.023688
0.00377
0.000264
0.002640
0.001252
0.000113
Componen
t % of Total
0.33%
0.05%
0.000189
0.000189
0.000377
5.91943
0.443957
5.090706
0.029597
0.118389
0.23677
1.25241
1.251153
0.001252
0.00254
0.002544
0.00348
0.003483
81.67%
17.28%
0.04%
0.05%
0.04241
0.042406
0.58%
PK117 (v1.2) September 28, 2006
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1
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