PK115 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 0.7361g

100% Material Declaration Data Sheet FTG256
PK115 (v1.3) September 15,
2011
Component
Substance
Description
Silicon Die
Die Attach
Mold Compound
Gold Wire
Solder Ball
Silicon
Silver (Ag)
Bismaleimide
monomer
Acrylate monomer
Epoxy Resin A
Epoxy Resin B
Phenol Resin A
Phenol Resin B
Metal Hydroxide
Carbon Black
Silica Fused
Silica Fused
Silica, crystalline
Gold (Au)
Palladium
Tin (Sn)
Silver (Ag)
Copper (Cu)
CAS Number
or
Description
Percentage
of
Component
7440-21-3
100.00
7440-22-4
Trade Secret
Trade Secret
77.50
15.00
7.50
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
3.00
3.00
3.00
3.00
1.50
0.30
70.90
15.00
0.30
7440-57-5
7440-05-3
99.05
0.95
7440-31-5
7440-02-4
7440-50-8
95.50
4.00
0.50
Average Weight: 0.7361g
Use in Product
Component Weight/
Substance Weight
(grams)
0.020003
0.020003
0.006372
0.004938
Component
Percent of
Total
2.717
0.866
0.000956
0.000478
0.382614
0.011478
0.011478
0.011478
0.011478
0.005739
0.001148
0.271273
0.057392
0.001148
0.009626
0.009534
0.000091
0.124093
0.118509
0.004964
0.000620
51.980
1.308
16.858
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK115 (v1.3) September 15, 2011
www.xilinx.com
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