PK114 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 4.2 g

PK114 (v1.3) September 13, 2007
100% Material Declaration
Data Sheet
FGG900
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Laminate
Bond Wire
Solder Balls
Silicon
7440-21-3
Silver
Resin
7440-22-4
Trade Secret
Epoxy Resins
Phenolic Resins
Carbon Black
SiO2 Filler
Bismuth
Metal Hydroxide
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Trade Secret
Bismaleimide/Triazine
Board
Epoxy
Glass Fiber (GF)
Copper
Nickel
Gold
Brominated Resin
13676-54-
5/25722-66-1
29690-82-2
65997-17-3
7440-50-8
7440-02-0
7440-57-5
68541-56-0
Gold
7440-57-5
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
% of
Component
Use in Product
100.00
78.00
22.00
6.00
6.00
0.500
84.00
Max. 1.00
2.50
17.63
10.59
15.72
49.01
1.32
0.23
5.50
Metal Layer
Metal Layer
Metal Layer
Flame Retardant
100.00
95.50
4.00
0.50
Average Weight: 4.2 g
Component Weight/
Substance Weight
(in grams)
0.119328
0.119328
0.0105
Component %
of Total
2.84%
0.25%
0.00819
0.00231
1.73292
41.26%
0.1039752
0.1039752
0.0086646
1.4556528
0.0173292
0.043323
1.48386
0.261604518
35.33%
0.157140774
0.233262792
0.727239786
0.019586952
0.003412878
0.0816123
0.0189
0.0189
0.83454
0.7969857
0.0333816
0.0041727
0.45%
19.87%
PK114 (v1.3) September 13, 2007
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1
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