PK108 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.94g

R
PK108 (v1.4) April 1, 2009
Component
Substance
Description
Silicon Die
Silicon
Die Attach Material
Polymetric Resin
Diester Resin
Acrylate Resin
Silver
Mold Compound
SiO2 Filler
Epoxy Resin A
Epoxy Resin B
Phenol Resin A
Phenol Resin B
Metal Hydroxide
Carbon Black
Substrate
Copper
Nickel
Gold
Glass Fiber (GF)
Halogen Fire
Retardant
BT (core)
Solder Mask (EP)
Gold Wire
Gold
Solder Balls
Tin
Silver
Copper
100% Material Declaration Data Sheet:
FGG400
CAS Number
or
Description
Percentage of
Component
7440-21-3
100.00
Trade Secret
Trade Secret
Trade Secret
7440-22-4
3.00
20.00
7.00
70.00
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
86.20
3.00
3.00
3.00
3.00
1.50
0.30
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
46.27
0.60
0.13
23.00
3.20
16.80
10.00
7440-57-5
100.00
7440-31-5
7440-22-4
7440-50-8
95.50
4.00
0.50
Use in
Product
Filler
Metal Layer
Metal Layer
Metal Layer
Average Weight: 1.94g
Component Weight/
Substance Weight
(Grams)
Component
Percent of Total
0.04944
0.04944
2.55%
0.00792
0.00023766
0.41%
0.00158440
0.00055454
0.00554540
0.00175
0.00150850
0.09%
0.00005250
0.00005250
0.00005250
0.00005250
0.00002625
0.00000525
1.53596
0.71068869
79.17%
0.00921576
0.00199675
0.35327080
0.04915072
0.25804128
0.15359600
0.01078
0.01078
0.33415
0.31911325
0.01336600
0.00167075
0.56%
17.22%
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PK108 (v1.4) April 1, 2009
www.xilinx.com
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