PK105 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.9408 g

PK105 (v1.1) June 29, 2006
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Laminate
Bond Wire
Solder Balls
Silicon
Silver
Resin
Epoxy Resins
SiO2
Laminate
Solder Mask
Copper
Nickel
Gold
Gold
Silver
Copper
Iron
Calcium
Palladium
Magnesium
Tin
Silver
Copper
100% Material Declaration
Data Sheet
FGG256
Material Declaration Data Sheet
CAS# or
Description
7440-21-3
2300
7440-22-4
Trade Secret
EME G770
Average Weight: 0.9408 g
% of
Component
Use in Product
100.00
78.00
22.00
Silver paste die
attach material
Component Weight/
Substance Weight
(in grams)
0.0749
0.0749
0.0074
0.0058
0.0016
0.3748
Component %
of Total
7.97%
0.78%
39.84%
Trade Secret
60676-86-0
CCL-HL832
(BT)
Trade Secret
Trade Secret
7440-50-8
7440-02-0
7440-57-5
MKE HTS-
Type
7440-57-5
7440-22-4
7440-50-8
7439-89-6
7440-70-2
7440-05-3
7439-95-4
7440-31-5
7440-22-4
7440-50-8
12.00
88.00
Filler
61.00
17.36
16.00
4.80
0.84
99.00
0.0025
0.0005
0.0005
0.0020
0.9900
0.0005
Metal Layer
Metal Layer
Metal Layer
Bonding die to
package
95.50
4.00
0.50
0.0450
0.3298
0.2085
0.1272
0.0362
0.0334
0.0100
0.0018
0.0043
0.004263581
0.000000108
0.000000022
0.000000022
0.000000086
0.000042636
0.000000022
0.2709
0.2587
0.0108
0.0014
22.16%
0.46%
28.79%
PK105 (v1.1) June 29, 2006
www.xilinx.com
1
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