PK104 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 0.145 g

PK104 (v1.5) June 10, 2011
100% Material Declaration Data Sheet FSG48
Component
Silicon Die
(FPGA)
Die Attach
Bonding Wire
Molding
Compound
Solder Balls
Substance
Description
CAS Number
or
Description
Silicon (Si)
Aluminium(Al)
Copper (Cu)
Titanium (Ti)
7440-21-3
7429-90-5
7440-50-8
7440-32-6
Silver (Ag)
Epoxy Cresol Novolak
Diisobutyrate derivate
7440-22-4
29690-82-2
6846-50-0
Gold (Au)
7440-57-5
Biphenyl epoxy resin
Phenol resin
Quartz
Silica, vitreous
Carbon black
Antimony Trioxide
Brominated epoxy
resin (Halogen)
85954-11-6
9003-35-4
14808-60-7
60676-86-0
1333-86-4
1309-64-4
Trade secret
Tin
Silver
Copper
Nickel (Ni)
Lead (Pb)
7440-31-5
7440-22-4
7440-50-8
7440-02-0
7439-92-1
Percentage
of
Component
99.91
0.04
0.02
0.02
75.00
24.80
0.20
100.00
12.00
7.00
2.50
77.00
0.50
0.50
0.50
98.27
1.20
0.50
0.02
0.01
Average Weight: 0.145 g
Use in Product
Silicon IC
Silicon IC
Silicon IC
Silicon IC
Glue
Glue
Glue
Wire
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Component Weight/
Substance Weight
(grams)
0.016285
0.016270
0.000007
0.000004
0.000004
0.001747
0.001310
0.000433
0.000003
0.000397
0.000397
0.079208
0.009505
0.005545
0.001980
0.060990
0.000396
0.000396
Component
Percent of Total
11.23
1.20
0.27
54.63
Encapsulation
0.000396
0.011790
8.13
Base metal
0.011586
Base metal
0.000141
Base metal
0.000059
Base metal
0.000002
Impurity
0.000001
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK104 (v1.5) June 10, 2011
www.xilinx.com
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