PK103 Datasheet, PDF (1/2 Pages) Xilinx, Inc – 100% Material Declaration

PK103 (v1.2) September 28, 2006
100% Material Declaration
Data Sheet
CSG144
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Material
Encapsulant
Tape
Metal Layers
Bond Wire
Solder Balls
Silicon
Silver
Resin (EP)
Epoxy Resins
Phenolic Resins
Carbon Black
Silica
Bismuth
Metal Hydroxide
Polymide
Adhesive
Copper
Nickel
Gold
Gold
Tin
Silver
Copper
CAS# or
Description
7440-21-3
7440-22-4
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Trade Secret
Trade Secret
Trade Secret
7440-50-8
7440-02-0
7440-57-5
7440-57-5
7440-31-5
7440-22-4
7440-50-8
% of
Component
100.00
52.00
48.00
6.00
6.00
0.50
84.00
Max 1.00
2.50
41.51
58.49
88.32
7.90
3.78
100.00
95.50
4.00
0.50
Use in Product
Average Weight: 0.3 g
Component Weight/
Substance Weight
(in grams)
0.01818
0.01818
0.00099
Component %
of Total
6.06%
0.33%
0.0005148
0.0004752
0.15591
0.0093546
0.0093546
0.00077955
0.1309644
0.0015591
0.00389775
0.01794
0.007446894
0.010493106
0.03285
0.02901312
0.00259515
0.00124173
0.00261
0.00261
0.07152
0.0683016
0.0028608
0.0003576
51.97%
5.98%
10.95%
0.87%
23.84%
PK103 (v1.2) September 28, 2006
www.xilinx.com
1
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