PK102 Datasheet, PDF (1/2 Pages) Xilinx, Inc – 100% Material Declaration

PK102 (v1.3) September 28, 2006
100% Material Declaration
Data Sheet
CSG48
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Encapsulant
Laminate
Bond Wire
Solder Balls
Silicon
7440-21-3
Resin (EP)
Silver
Trade Secret
7440-22-4
Epoxy Resins
Phenolic Resins
Carbon Black
Silica
Bismuth
Metal Hydroxide
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Trade Secret
Bismaleimide/Triazine
Board
Copper
Nickel
Gold
Antimony Pentoxide
Brominated Resin
13676-54-5 /
25722-66-1
7440-50-8
7440-02-0
7440-57-5
1314-60-9
68541-56-0
Gold
7440-57-5
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
% of
Component
Use in Product
100.00
22.00
78.00
6.00
6.00
0.50
84.00
Max 1.00
2.50
72.685
9.880
7.270
1.160
0.005
9.000
Flame Retardant
Flame Retardant
100.00
95.50
4.00
0.50
Average Weight: 0.2 g
Component Weight/
Substance Weight
(in grams)
0.00562
0.00562
0.00118
Component %
of Total
2.81%
0.59%
0.0002596
0.009204
0.0947
0.005682
0.005682
0.0004735
0.079548
0.000947
0.0023675
0.0301
0.021878185
47.35%
15.05%
0.00297388
0.00218827
0.00034916
0.000001505
0.002709
0.00036
0.00036
0.06804
0.0649782
0.0027216
0.0003402
0.18%
34.02%
PK102 (v1.3) September 28, 2006
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