PK101 Datasheet, PDF (1/2 Pages) Xilinx, Inc – 100% Material Declaration

PK101 (v1.3) September 28, 2006
100% Material Declaration
Data Sheet
CPG132
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
% of
Component
Use in Product
Silicon Die
Die Attach
Material
Encapsulant
Laminate
Bond Wire
Solder Balls
Silicon
7440-21-3
Silver
Resin (EP)
7440-22-4
Trade Secret
Epoxy Resins
Phenolic Resins
Carbon Black
Silica
Bismuth
Metal Hydroxide
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Trade Secret
Bismaleimide/Triazine
Board
Copper
Nickel
Gold
Antimony Pentoxide
Brominated Resin
13676-54-5 /
25722-66-1
7440-50-8
7440-02-0
7440-57-5
1314-60-9
68541-56-0
Gold
7440-57-5
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
100.00
78.00
22.00
6.00
6.00
0.50
84.00
Max 1.00
2.50
72.685
9.880
7.270
1.160
0.005
9.000
Flame Retardant
Flame Retardant
100.00
95.50
4.00
0.50
Average Weight: 0.1 g
Component Weight/
Substance Weight
(in grams)
0.00203
0.00203
0.00038
Component %
of Total
2.03%
0.38%
0.0002964
0.0000836
0.03444
0.0020664
0.0020664
0.0001722
0.0289296
0.0003444
0.000861
0.01085
0.0078863225
34.44%
10.85%
0.00107198
0.000788795
0.00012586
0.0000005425
0.0009765
0.00022
0.00022
0.05208
0.0497364
0.0020832
0.0002604
0.22%
52.08%
PK101 (v1.3) September 28, 2006
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