PK100 Datasheet, PDF (1/2 Pages) Xilinx, Inc – 100% Material Declaration

PK100 (v1.2) September 28, 2006
100% Material Declaration
Data Sheet
CPG56
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Encapsulant
Laminate
Bond Wire
Solder Balls
Silicon
7440-21-3
Silver
Resin (EP)
7440-22-4
Trade Secret
Epoxy Resins
Phenolic Resins
Carbon Black
Silica
Bismuth
Metal Hydroxide
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Trade Secret
Bismaleimide/Triazine 13676-54-5 /
Board
25722-66-1
Copper
7440-50-8
Nickel
7440-02-0
Gold
7440-57-5
Antimony Pentoxide 1314-60-9
Brominated Resin 68541-56-0
Gold
7440-57-5
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
% of
Component
Use in Product
100.00
78.00
22.00
6.00
6.00
0.50
84.00
Max 1.00
2.50
72.285
9.780
7.890
1.140
0.005
8.900
Flame Retardant
Flame Retardant
100.00
95.50
4.00
0.50
Average Weight: 0.1 g
Component Weight/
Substance Weight
(in grams)
0.00215
0.00215
0.0005
Component %
of Total
2.15%
0.50%
0.00039
0.00011
0.03956
0.0023736
0.0023736
0.0001978
0.0332304
0.0003956
0.000989
0.0126
0.00910791
39.56%
12.60%
0.00123228
0.00099414
0.00014364
0.00000063
0.0011214
0.00023
0.00023
0.04496
0.0429368
0.0017984
0.0002248
0.23%
44.96%
PK100 (v1.2) September 28, 2006
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