PK099 Datasheet, PDF (1/2 Pages) Xilinx, Inc – 100% Material Declaration

PK099 (v1.2) September 28, 2006
100% Material Declaration
Data Sheet
SFG363
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon die
Solder Bump
Underfill
Silicon
Tin
Lead
7440-21-3
7440-31-5
7439-92-1
Substrate
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
60676-86-0
9003-36-5
25068-38-6
19900-65-3
Cu
Ni
Au
Glass fiber
Halogen fire retardant
BT (core)
Solder mask
7440-50-8
7440-02-0
7440-57-5
NA
NA
NA
NA
Heat spreader
Copper
7440-50-8
Heat Spreader
Adhesive
Solder Balls
Chromium
7440-47-3
Organopolysiloxane NA
mixture
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
Average Weight: 1.4769280 g
% of
Component
Use in Product
100.00
63.00
37.00
70.00
20.00
3.00
7.00
47.52
0.52
0.11
10.35
5.30
27.50
8.70
metal layer
metal layer
metal layer
99.90
0.10
Component Weight/
Substance Weight
(in grams)
0.082390
0.082390
0.113006
0.07122654
0.04183146
0.023000
0.01610000
0.00460000
0.00069000
0.00161000
0.230000
0.10929600
0.00119600
0.00025300
0.02380500
0.01219000
0.06325000
0.02001000
0.800000
0.79920000
0.00080000
Component %
of Total
5.578%
7.651%
1.557%
15.573%
54.166%
0.053000
3.589%
100.00
0.053000
95.50
4.00
0.50
0.17548
0.167583
0.007019
0.000877
11.881%
PK099 (v1.2) September 28, 2006
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