PK097 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 20.7999g

PK097 (v1.3) July 20, 2010
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Sink
Heat Sink
Adhesive
Laminate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Silane compound
Filler materials
Polymetric resin
Copper
Nickel
Gold
Glass fiber
Halogen fire
retardant
BT (core)
Solder mask
Tin
Silver
Copper
100% Material Declaration Data Sheet
FFG1696
CAS Number
or
Description
Percentage of
Component
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7440-22-4
7440-50-8
100.00
63.00
37.00
70.00
20.00
3.00
7.00
99.90
0.10
70.00
27.00
3.00
47.61
0.51
0.11
10.35
5.25
27.54
8.63
95.50
4.00
0.50
Average Weight: 20.7999g
Use in
Product
Metal layer
Metal layer
Metal layer
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
1.187223
5.708
1.187223
0.008333
0.040
0.005250
0.003083
0.147000
0.707
0.102900
0.029400
0.004410
0.010290
13.300000
63.943
13.286700
0.0133300
0.085000
0.409
0.059500
0.022950
0.002550
4.652150
22.366
2.214911
0.023726
0.005117
0.481502
0.244054
1.281355
0.401485
1.420156
1.356249
0.056806
0.007101
6.828
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countries. All other trademarks are the property of their respective owners.
PK097 (v1.3) July 20, 2010
www.xilinx.com
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