PK096 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 18.83g

PK096 (v1.4) July 20, 2010
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Epoxy Resin A
Epoxy Resin B
Silica
Hardener
Copper
Nickel
Organopolysiloxane
mixture
Copper
Nickel
Gold
Halogen fire
retardant
Glass fiber
BT (core)
Solder mask
Tin
Silver
Copper
100% Material Declaration Data Sheet
FFG1517
CAS Number
or
Description
Percentage of
Component
7440-21-3
7440-31-5
7439-92-1
9003-36-5
25068-38-6
60676-86-0
19900-65-3
7440-50-8
7440-02-0
N/A
100.00
63.00
37.00
20.00
3.00
70.00
7.00
99.90
0.10
100.00
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7440-22-4
7440-50-8
47.15
0.53
0.12
5.25
10.30
28.00
8.65
95.50
4.00
0.50
Use in
Product
Average Weight: 18.83g
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
1.0390
5.52
1.0390
0.05127
0.27
0.03229934
0.01896946
0.0740
0.40
0.014800
0.002220
0.051800
0.005180
9.0000
47.79
8.99100
0.00900
0.1500
0.79
0.1500
Metal layer
Metal layer
Metal layer
7.250
3.41837500
0.03842500
0.00870000
0.38062500
38.50
0.74675000
2.03000000
0.62712500
1.26725
1.21022375
0.05069000
0.00633625
6.73
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countries. All other trademarks are the property of their respective owners.
PK096 (v1.4) July 20, 2010
www.xilinx.com
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