PK095 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 18.5g

PK095 (v1.4) July 20, 2010
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Silicon
Tin
Lead
Epoxy Resin A
Epoxy Resin B
Silica
Hardener
Copper
Nickel
Organopolysiloxane
mixture
Copper
Nickel
Gold
BT (core)
Solder Balls
Glass fiber
Halogen fire
retardant
Solder mask
Tin
Silver
Copper
100% Material Declaration Data Sheet
FFG1513
CAS Number
or
Description
Percentage of
Component
7440-21-3
7440-31-5
7439-92-1
9003-36-5
25068-38-6
60676-86-0
19900-65-3
7440-50-8
7440-02-0
100.00
63.00
37.00
20.00
3.00
70.00
7.00
99.90
0.10
100.00
7440-50-8
7440-02-0
7440-57-5
13676-54-4/
25722-66-1
65997-17-3
N/A
Trade secret
7440-31-5
7440-22-4
7440-50-8
46.91
0.52
0.12
28.00
10.50
5.25
8.70
95.50
4.00
0.50
Use in
Product
Average Weight: 18.5g
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
1.06135
5.74
1.06135
0.05432
0.29
0.03422034
0.02009766
0.0440
0.25
0.008800
0.001320
0.030800
0.003080
3.0000
16.22
2.99700
0.00300
0.053
0.28
0.053000
Metal layer
Metal layer
Metal layer
13.32398
6.25027996
0.06928471
0.01598878
3.73071496
72.03
1.39901811
0.69950906
1.15918643
0.96318
5.21
0.91983690
0.03852720
0.00481590
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PK095 (v1.4) July 20, 2010
www.xilinx.com
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