PK092 Datasheet, PDF (1/2 Pages) Xilinx, Inc – 100% Material Declaration Data Sheet

PK092 (v1.3) July 20, 2010
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Sink
Solder Paste
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Tin
Silver
Copper
Copper
Nickel
Gold
BT (core)
Glass fiber
Halogen fire
retardant
Solder mask
Tin
Silver
Copper
100% Material Declaration Data Sheet
FFG896
CAS Number
or
Description
Percentage of
Component
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7440-22-4
7440-50-8
100.00
63.00
37.00
70.00
20.00
3.00
7.00
99.97
0.03
95.50
4.00
0.50
47.61
0.51
0.11
27.54
10.35
5.25
8.63
95.50
4.00
0.50
Use in
Product
Metal layer
Metal layer
Metal layer
Average Weight: 11.2g
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
0.50736
4.53
0.50736
0.00336
0.03
0.0021168
0.0012432
0.05824
0.52
0.040768
0.011648
0.0017472
0.0040768
7.32928
65.44
7.327081216
0.002198784
0.05264
0.47
0.0502712
0.0021056
0.0002632
2.46512
22.01
1.173643632
0.012572112
0.002711632
0.678894048
0.25513992
0.1294188
0.212739856
0.784
7.00
0.74872
0.03136
0.00392
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PK092 (v1.3) July 20, 2010
www.xilinx.com
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