PK091 Datasheet, PDF (1/1 Pages) Xilinx, Inc – 100% Material Declaration Data Sheet for FFG672

100% Material Declaration Data Sheet for FFG672
PK091 (v1.5) May 13, 2016
Component
Silicon Die
Solder Bump
Solder Paste
Capacitor 1
Underfill
Lid
Lid Adhesive
Solder Ball
Substrate
Substance Description
Si
Sn
Pb
Sn
Ag
Cu
Barium titanium trioxide
Copper
Nickel
Nickel
Tin
Bisphenol F/ epichlorohydrin
copolymer
Phenolic resin
Bisphenol A type liquid epoxy resin
Amine type accelerator
Silicon dioxide
Carbon black
Additives
Cu
Ni
Aluminum oxide(Al2O3)
Zinc oxide (ZnO)
Silicone
Sn
Ag
Cu
CAS # or Description
7440-21-3
7440-31-5
7439-92-1
7440-31-5
7440-22-4
7440-50-8
12047-27-7
7440-50-8
7440-02-0
7440-02-0
7440-31-5
9003-36-5
trade secret
25068-38-6
trade secret
60676-86-0
1333-86-4
trade secret
7440-50-8
8049-31-8
1344-28-1
1314-13-2
Trade Secret
7440-31-5
7440-22-4
7440-50-8
Copper
Tin
Lead
Silver
Core
ABF
Solder Mask
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
Average Weight :
6.5119
% of Component Use in product
100.000
basis
63.000
37.000
basis
basis
96.500
3.000
0.500
metal
metal
metal
51.100
16.900
27.000
2.000
3.000
Ceramic
Inner electrode
Out electrode
Plating1
Plating2
20.000
15.000
5.000
5.000
51.500
1.000
2.500
99.450
0.550
70.000
15.000
15.000
95.500
4.000
0.500
basis
basis
basis
basis
basis
basis
Additive
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
52.18
0.91
0.21
0.02
28.49
15.26
2.93
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Component Weight
0.458097
0.458097
0.024729
0.015580
0.009150
0.048000
0.046320
0.001440
0.000240
0.016000
0.008176
0.002704
0.004320
0.000320
0.000480
0.056000
0.011200
0.008400
0.002800
0.002800
0.028840
0.000560
0.001400
3.040000
3.023280
0.016720
0.106000
0.074200
0.015900
0.015900
0.562885
0.537555
0.022515
0.002814
2.200189
1.148059
0.020022
0.004620
0.000440
0.626834
0.335749
0.064466
g
Component % of total
7.035%
0.380%
0.737%
0.246%
0.860%
46.684%
1.628%
8.644%
33.787%
Revision History
Date
03/14/2006
08/11/2006
09/27/2006
07/20/2010
04/08/2011
05/13/2016
Version
1.0
1.1
1.2
1.3
1.4
1.5
Description of Revisions
Initial Initial release.
100% Material Declaration.
Updated component
descriptions.
Updated Heat Spreader
substance description
Updated component
descriptions and weights
Updated substrate
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or
completeness, including, but not limited to, with respect to its compliance with applicable
environmental laws and regulations. Xilinx subcontracts the production, test and assembly of
hardware devices to independent third-party vendors and materials suppliers (“Contractors”).
All data provided hereunder is based on information received from Contractors. Xilinx has not
independently verified the accuracy or completeness of this information which is provided
solely for your reference in connection with the use of Xilinx products.
© Copyright 2016 Xilinx