PK090 Datasheet, PDF (1/1 Pages) Xilinx, Inc – 100% Material Declaration Data Sheet for FFG668

100% Material Declaration Data Sheet for FFG668
PK090 (v1.4) May 13, 2016
Component
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader Adhesive
Solder Balls
Substrate
Revision History
Date
03/04/2016
05/01/2006
09/22/2006
07/20/2010
05/13/2016
Substance Description
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Zinc oxide
Other
Tin
Silver
Copper
Copper
Tin
Lead
Silver
Core
ABF
Solder Mask
CAS # or Description
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
1314-13-2
NA
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-31-5
7439-92-1
7440-22-4
NA
NA
NA
Average Weight :
4.9150
% of Component Use in product
100.000
63.000
37.000
70.000
20.000
3.000
7.000
99.900
0.100
35.000
65.000
95.500
4.000
0.500
44.28
1.01
0.14
0.02
39.72
10.67
4.16
metal layer
metal layer
metal layer
Component Weight
0.430700
0.430700
0.021443
0.013509
0.007934
0.044000
0.030800
0.008800
0.001320
0.003080
3.000000
2.997000
0.003000
0.032500
0.017500
0.032500
0.558020
0.532909
0.022321
0.002790
0.819560
0.362901
0.008278
0.001147
0.000164
0.325529
0.087447
0.034094
g
Component % of total
8.747%
0.436%
0.894%
60.929%
1.076%
11.333%
16.645%
Version
1.0
1.1
1.2
1.3
1.4
Description of Revisions
Initial Initial release.
100% Material Declaration.
Updated component
descriptions.
Updated Heat Spreader
substance description
Updated Substrate
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or
completeness, including, but not limited to, with respect to its compliance with applicable
environmental laws and regulations. Xilinx subcontracts the production, test and assembly of
hardware devices to independent third-party vendors and materials suppliers (“Contractors”).
All data provided hereunder is based on information received from Contractors. Xilinx has not
independently verified the accuracy or completeness of this information which is provided
solely for your reference in connection with the use of Xilinx products.
© Copyright 2016 Xilinx