B1S_06 Datasheet, PDF (1/4 Pages) Won-Top Electronics – 0.5A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER

WTE
POWER SEMICONDUCTORS
B1S – B10S ^Pb
0.5A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Features
! Glass Passivated Die Construction
! Low Forward Voltage Drop
! High Current Capability
! High Surge Current Capability
! Designed for Surface Mount Application
B
! Plastic Material – UL Flammability 94V-O
!
Recognized File # E157705





















































Mechanical Data
J
! Case: MB-S, Molded Plastic
! Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
! Polarity: As Marked on Case
! Weight: 0.22 grams (approx.)
! Mounting Position: Any
! Marking: Type Number
! Lead Free: For RoHS / Lead Free Version,
Add “-LF” Suffix to Part Number, See Page 4
G
-
+
H
~
~
DE
C
A
L
MB-S
Dim
Min
Max
A
4.50
4.90
B
3.80
4.20
C
0.15
0.35
K
D
—
0.20
E
—
7.00
G
0.70
1.10
H
1.30
1.70
J
2.30
2.70
K
2.30
2.70
L
—
3.00
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @T_A=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (Note 1) @T_A = 40°C
Average Rectified Output Current (Note 2) @T_A = 40°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I²t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
@I_F = 0.5A
Peak Reverse Current
At Rated DC Blocking Voltage
@T_A = 25°C
@T_A = 125°C
Typical Junction Capacitance per leg (Note 3)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
Symbol
VRRM
VRWM
VR
VR(RMS)
IO
B1S
100
70
B2S
200
140
B4S B6S
400
600
280
420
0.5
0.8
B8S B10S Unit
800 1000 V
560
700
V
A
IFSM
30
A
I²t
VFM
IRM
Cj
R
JA
R
JL
Tj, TSTG
5.0
1.0
5.0
500
25
85
20
-55 to +150
A²s
V
µA
pF
°C/W
°C
Note: 1. Mounted on glass epoxy PC board with 1.3mm² solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm² solder pad.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
B1S – B10S
1 of 4
© 2006 Won-Top Electronics