WM8731_06 Datasheet, PDF (62/63 Pages) Wolfson Microelectronics plc – Portable Internet Audio CODEC with Headphone Driver and Programmable Sample Rates

WM8731 / WM8731L
PACKAGE DIMENSIONS - QFN
FL: 28 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm LEAD PITCH
CORNER
D2
SEE DETAIL A
TIE BAR
B
5
D2/2
D
22
27 28
L
INDEX AREA
(D/2 X E/2)
21
1
EXPOSED
GROUND 6
PADDLE
2
E2/2
A
A E2
15
7
SEE DETAIL B
14 13
8
e
B
BOTTOM VIEW
b
ccc M C A B
(A3)
A
1
C SEATING PLANE _{SIDE VIEW}
A1
ccc C
0.08 C
2X
aaa C
2X
aaa C
TOP VIEW
DETAIL A
1
28x b
bbb M C A B
DETAIL B
EXPOSED
GROUND
PADDLE
DM023.F
E
CORNER
TIE BAR
5
0.15
0.210mm
L1 1
Production Data
Symbols
A
A1
A3
b
D
D2
E
E2
e
L
L1
R
K
aaa
bbb
ccc
REF:
Dimensions (mm)
MIN
NOM
MAX
NOTE
0.85
0.90
1.00
0
0.02
0.05
0.2 REF
0.18
0.23
0.30
1
5.00 BSC
3.2
3.3
3.4
2
5.00 BSC
3.2
3.3
3.4
2
0.5 BSC
0.35
0.4
0.45
0.1
1
b(min)/2
0.20
Tolerances of Form and Position
0.15
0.10
0.10
JEDEC, MO-220, VARIATION VKKD-2
NOTES:
1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. DIMENSION L1 REPRESENTS TERMINAL PULL BACK FROM
PACKAGE SIDE WALL. MAXIMUM OF 0.1mm IS ACCEPTABLE. WHERE TERMINAL PULL BACK EXISTS, ONLY UPPER HALF OF LEAD IS VISIBLE ON PACKAGE SIDE WALL DUE TO HALF
ETCHING OF LEADFRAME.
2. FALLS WITHIN JEDEC, MO-220 WITH THE EXCEPTION OF D2, E2:
D2,E2: LARGER PAD SIZE CHOSEN WHICH IS JUST OUTSIDE JEDEC SPECIFICATION
3. ALL DIMENSIONS ARE IN MILLIMETRES
4. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
5. SHAPE AND SIZE OF CORNER TIE BAR MAY VARY WITH PACKAGE TERMINAL COUNT. CORNER TIE BAR IS CONNECTED TO EXPOSED PAD INTERNALLY
6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
w
PD Rev 4.2 November 2005
62