W55RFS27R3C Datasheet, PDF (9/13 Pages) Winbond – Super-Regeneration RF Receiver

W55RFS27R3C
3.3 W55RFS27R3C Ordering Information
The W55RFS27R3C is available in two types of packages: Dice form and Wafer form.
PART NUMBER
PACKAGE
REMARKS
W55RFS27R3C(H)
Dice form
W55RFS27R3C(W)
Wafer form
3.4 W55RFS27R3C Package Information
3.4.1 W55RFS27R3C Bonding Pad List
Window : (xl = -1228.000, yl = -625.000),(xh = 1228.000, yh = 625.000)
Windows size : Width = 2456.000, length = 1250.000
===========================================================================
PAD NO
PAD NAME
PIN NO(DIP28)
X
Y
---------------------------------------------------------------------------
1
* GND
*1
2
CMFB
2
-33.015
-385.965
540.000
540.000
3
RBIAS
3
-492.965
540.000
4
RSAW
4
5
VDDA:
5
-599.965
-709.365
540.000
540.000
6
VDDA:
5
-821.165
540.000
7
GND_LNA
6
-1143.000
532.375
8
VDD_LNA
7
-1143.000
420.975
9
SDINGD
8
-1143.000
308.495
10
LNAING
9
-1143.000
174.685
11
LNAINS
10
-1143.000
-46.460
12
LNAOUT
11
-1143.000
-525.320
13
OSCin
12
-815.090
-540.000
14
OSCout
13
-685.215
-540.000
15
GNDA
14
-575.165
-540.000
16
resetn
15
-148.690
-540.000
17
MODE
16
-41.690
-540.000
18
ID0
17
65.310
-540.000
19
ID1
18
172.310
-540.000
20
TEST
19
279.310
-540.000
21
F1
20
389.910
-540.000
------------------------------21(GND) -------------------------------------
Publication Release Date: May 31, 2005
-9-
Revision A1