W55RFS27R1B Datasheet, PDF (9/15 Pages) Winbond – SUPER-REGENERATION RF RECEIVER

W55RFS27R1B
3.3 W55RFS27R1B Ordering Information
The W55RFS27R1B is available in two types: Dice form and Wafer form.
PART NUMBER
W55RFS27R1B(H)
W55RFS27R1B(W)
PACKAGE
Dice form
Wafer form
REMARKS
3.4 W55RFS27R1B Package Information
3.4.1 W55RFS27R1B Bonding Pad List
---------------------------------------------------------------------------
Window : (xl = -929.000, yl = -625.000),
(xh = 929.000, yh = 625.000)
Windows size : Width = 1858.000, length = 1250.000
===========================================================================
PAD NO
PAD NAME
PIN NAME
X
Y
---------------------------------------------------------------------------
1
* GND
*1
-13.000
540.000
2
CMFB
2
-365.950
540.000
3
RBIAS
3
-472.950
540.000
4
RSAW
4
-579.950
540.000
5
VDDA
5
-689.350
540.000
6
VDDA
5
-801.150
540.000
7
OSCin
6
-795.075
-540.000
8
OSCout
7
-667.875
-540.000
9
GNDA
8
-555.150
-540.000
10
reset
9
-128.675
-540.000
11
MODE0
10
-21.675
-540.000
12
MODE1
11
85.325
-540.000
13
TEST
12
192.325
-540.000
14
F2
13
302.925
-540.000
15
F1
14
790.325
540.000
16
R
15
675.875
540.000
17
L
16
561.425
540.000
18
B
17
446.975
540.000
19
F
18
332.525
540.000
20
RXD
19
218.075
540.000
21
VSPLY
20
98.400
540.000
(*: Bonding Sequence start from GND(Pin1))
Publication Release Date:June 8, 2005
-9-
Revision A3