W24LH8 Datasheet, PDF (9/10 Pages) Winbond – Normal speed, Very low power CMOS static RAM Organized as 32768 x 8 bits

W24LH8
PACKAGE DIMENSIONS
28-pin SOP Wide Body
28
15
e1
E HE
θ
L
Detail F
1
14
b
D
A2 A
S
e
y
A1
Seating Plane
e1
c
LE
See Detail F
Dimension in Inches
Dimension in mm
Symbol _{Min. Nom. Max. Min. Nom. Max.}
A
0.112
2.85
A 1 ^0.004
0.10
A2
0.093 0.098 0.103 2.36 2.49 2.62
b
0.014 0.016 0.020 0.36 0.41 0.51
c
0.008 0.010 0.014 0.20 0.25 0.36
D
0.713 0.733
18.11 18.62
E
0.326 0.331 0.336 8.28 8.41 8.53
e
0.044 0.050 0.056 1.12 1.27 1.42
HE
0.453 0.465 0.477 11.51 11.81 12.12
L
0.028 0.036 0.044 0.71 0.91 1.12
LE
0.059 0.067 0.075 1.50 1.70 1.91
S
0.047
1.19
y
0.004
0.10
θ
0
10
0
10
Notes:
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimensions D & E i.nclude mold mismatch
and determined at the mold parting line.
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
28-pin Standard Type One TSOP
HD
D
1
e
b
θ
L
L1
c
E
A2 A
A1
Y
Dimension In Inches Dimension In mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
A1
A2
b
c
D
E
HD
e
L
L1
Y
θ
0.047
1.20
0.002
0.006
0.035 0.040 0.041
0.007 0.008 0.011
0.004 0.006 0.008
0.461 0.465 0.469
0.311 0.315 0.319
0.05
0.95
0.17
0.10
11.70
7.90
0.15
1.00 1.05
0.20 0.27
0.15 0.21
11.80 11.90
8.00 8.10
0.520
0.020
0.528
0.022
0.024
0.010
0.536
0.028
13.20
0.50
13.40
0.55
0.60
0.25
13.60
0.70
0.000
0.004 0.00
0.10
0
3
5
0
3
5
Controlling dimension: Millimeters
Publication Release Date: March 2001
-9-
Revision A3