W24512A1111 Datasheet, PDF (9/10 Pages) Winbond – 64K X 8 HIGH SPEED CMOS STATIC RAM

W24512A
Package Dimensions, continued
32-pin TSOP
HD
D
Me
0.10(0.004)
b
θ_L
L1
c
E
A
A2
A1
Y
Dimension in Inches
Symbol
Min. Nom. Max.
A
__ __
0.047
A1
0.002
__
0.006
Dimension in mm
Min. Nom.
__ __
0.05 ^__
Max.
1.20
0.15
A 2 0.037 0.039 0.041 0.95 1.00 1.05
b
0.007 0.008 0.009 0.17 0.20 0.23
c
0.005 0.006 0.007 0.12 0.15 0.17
D
0.720 0.724 0.728 18.30 18.40 18.50
E
0.311 0.315 0.319 7.90 8.00 8.10
H D ^{0.780 0.787} 0.795 ^19.80 20.00 20.20
e
__
__
0.020
__
__
0.50
L
0.016 0.020 0.024 0.40 0.50 0.60
L1
__
__ __
__
0.031
0.80
Y
0.000
__
__
0.004 0.00
0.10
θ
1
3
5
1
3
5
Note:
Controlling dimension: Millimeter
32-pin P-DIP Skinny (300 mil)
32
E1
1
S
A A2
L
D
B1
e1
B
17
16
E
Base Plane
A1
Mounting Plane
a
eA
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
0.200
5.08
A1
0.015
0.38
A2
0.145 0.150 0.155 3.68 3.81 3.94
B
0.016 0.018 0.022 0.41 0.46 0.56
B1
0.058 0.060 0.064 1.47 1.52 1.63
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.60 1.62
40.64 41.15
E
0.295 0.315 0.335 7.49 8.00 8.50
E1
0.286 0.290 0.294 7.26 7.36 7.46
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0°
15°
eA
0.430 0.450 0.470 10.92 11.43 11.94
S
0.065
1.65
Notes:
1. Dimension D Max. & S include mold flash or
c
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
Publication Release Date: March 1999
-9-
Revision A7