W241024A Datasheet, PDF (9/11 Pages) Winbond – 128L X 8 HIGH SPEED CMOS STATIC RAM

W241024A
Package Dimensions, continued
32-pin SOJ (400 mil)
32
17
HE
E
1
16
D
s
b
b1
Seating Plane
A2
A
L
e
A1
y
c
e1
Dimension in inches
Symbol _{Min. Nom. Max.}
Dimension in mm
Min. Nom. Max.
A
0.131 0.138 0.145 3.33 3.51 3.68
A 1 0.025
0.635
A 2 0.105 0.110 0.115 2.67 2.79 2.91
b 1 ^{0.026 0.028 0.032 0.66 0.71 0.81}
b
0.016 0.018 0.020 0.41 0.46 0.51
c
0.006 0.008 0.011 0.15 0.20 0.28
D
0.820 0.825 0.830 20.83 20.96 21.08
E
0.395 0.400 0.405 10.03 10.16 10.29
e
0.044 0.050 0.056 1.12 1.27 1.42
e1
0.360 0.37 0.380 9.15 9.40 9.65
H E ^0.435 0.440 0.445 ^11.05 11.18 11.31
L
0.082
2.08
S
0.045
1.14
y
0.004
0.10
θ
-5
2
6
-5
2
6
Notes:
1. Dimension D Max & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimension D & E include mold mismatch
and are determined at the mold parting line.
4. Controlling dimension: Inches
5. General appearance spec. should be based
on final visual inspection spec.
32-pin Standard Type One TSOP
HD
D
Me
0.10(0.004)
b
θ_L
L1
c
E
A
A2
A1
Y
Symbol
A
A1
Dimension in Inches
Min.
__
0.002
Nom.
__
__
Max.
0.047
0.006
Dimension in mm
Min. Nom.
__ __
0.05 ^__
Max.
1.20
0.15
A 2 0.037 0.039 0.041 0.95 1.00 1.05
b
0.007 0.008 0.009 0.17 0.20 0.23
c
0.005 0.006 0.007 0.12 0.15 0.17
D
0.720 0.724 0.728 18.30 18.40 18.50
E
0.311 0.315 0.319 7.90 8.00 8.10
H D ^{0.780 0.787} 0.795 ^19.80 20.00 20.20
e
__
__
0.020
__
__
0.50
L
0.016 0.020 0.024 0.40 0.50 0.60
L1
__
__ __
__
0.031
0.80
Y
0.000
__
__
0.004 0.00
0.10
θ
1
3
5
1
3
5
Note:
Controlling dimension: Millimeter
Publication Release Date: July 1998
-9-
Revision A9