W24L257A Datasheet, PDF (8/9 Pages) Winbond – 32K X 8 High Speed CMOS Static RAM

W24L257A
PACKAGE DIMENSIONS
28-pin P-DIP Skinny
D
28
15
E1
1
14
S
A A2
L
B
e1
B1
Base Plane
A1
E
c
Mounting Plane
a
eA
Symbol
Dimension in Inches Dimension in mm
Min. Nom. Max. Min. Nom. Max.
A
0.175
4.45
A1
0.010
0.25
A2
0.125 0.130 0.135 3.18 3.30 3.43
B
0.016 0.018 0.022 0.41 0.46 0.56
B1
0.058 0.060 0.064 1.47 1.52 1.63
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.388 1.400
35.26 35.56
E
0.300 0.310 0.320 7.62 7.87 8.13
E1
0.283 0.288 0.293 7.19 7.32 7.44
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0°
15°
0°
15°
eA
0.330 0.350 0.370 8.38 8.89 9.40
S
0.055
1.40
Notes:
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
28-pin Small Outline J Band
28
15
E HE
1
14
D
s
b
b1
e
Seating Plane
c
A2 _A
L
£c
A1
e1
y
Symbol
A
A1
A2
b1
b
c
D
E
e
e1
HE
L
S
y
θ
Dimension in Inches Dimension in mm
Min. Nom. Max. Min. Nom. Max.
0.140
3.56
0.027
0.69
0.095 0.100 0.105 2.41 2.54 2.67
0.026 0.028 0.032 0.66 0.71 0.81
0.016 0.018 0.022 0.41 0.46 0.56
0.008 0.010 0.014 0.20 0.25 0.36
0.710 0.730
18.03 18.54
0.295 0.300 0.305 7.49 7.62 7.75
0.044 0.050 0.056 1.12 1.27 1.42
0.245 0.265 0.285 6.22 6.73 7.24
0.327 0.337 0.347 8.31 8.56 8.81
0.077 0.087 0.097 1.96 2.21 2.46
0.045
1.14
0.004
0.10
0
10
0
10
Notes:
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimensions D & E include mold mismatch
and are determined at the mold parting line.
4. Controlling dimension: Inches.
5. General appearance spec. should be based
on final visual inspection spec.
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