W25Q64CV_13 Datasheet, PDF(78/80 Page) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

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W25Q64CV_13 Datasheet, PDF (78/80 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

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W25Q64CV

10.1 Valid Part Numbers and Top Side Marking

The following table provides the valid part numbers for the W25Q64CV SpiFlash Memory. Please contact

Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-

digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages

use an abbreviated 10-digit number.

Part Numbers for Industrial Grade Temperature:

PACKAGE TYPE

SOIC-8 208mil

VSOP-8 208mil

SOIC-16 300mil

PDIP-8 300mil

ZP(1)

WSON-8 6x5mm

ZE(1)

WSON-8 8x6mm

TB(2)

TFBGA-24 8x6mm

5x5 ball array

TC(2)

TFBGA-24 8x6mm

6x4 ball array

DENSITY

64M-bit

PRODUCT NUMBER

W25Q64CVSSIG

W25Q64CVSTIG

W25Q64CVSFIG

W25Q64CVDAIG

W25Q64CVZPIG

W25Q64CVZEIG

W25Q64CVTBIG

W25Q64CVTCIG

TOP SIDE MARKING

25Q64CVSIG

25Q64CVTIG

25Q64CVFIG

25Q64CVAIG

25Q64CVIG

25Q64CVBIG

25Q64CVCIG

Notes:

1. WSON package type ZP & ZE are not used in the top side markings.

2. These Package types are Special Order only, please contact Winbond for more information.

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