W55MID50 Datasheet, PDF (7/10 Pages) Winbond – WINBOND MFID READER

W55MID50 Data Sheet
Electronic Characteristics
3.1 W55MID50 Absolute Maximum Ratings
Parameter
Maximum Current in COIL
Power Dissipation (T_a = 70°C)
Ambient Operating Temperature
Storage Temperature
Rating
10
100
0 to +70
-40 to +85
Unit
mA
mW
°C
°C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
3.2 W55MID50 DC Characteristics
(VDD-VSS = 4.5 V, Ta = 25°C; unless otherwise specified)
Parameter
Sym.
Operating Magnetic Field
f_OP
Operating Voltage
Operating Temperature
V_DD
Tamb
Operating Current
I_OP
Stand-by Current
I_SB
Sink Current
I_SK
Source Current
I_SR
Conditions
Field in resonation
Field in resonation
Ambient operating temp
f_OP = 13.56MHz
Power Down mode enter
VoL = 0.3VDD
VoH = 0.7VDD
Min.
-
3
0
-
-
-
-
Typ.
13.56
-
25
22
0.7
10
-6
Max.
-
5.5
70
-
1
-
-
Unit
MHz
V
°C
mA
uA
mA
mA
3.3 W55MID50 Ordering Information
W55MID50 provides two types of package in shipment: Dice form, PDIP-20, SOP-20, and Wafer
Part Number
W55MID50
W55MID50
W55MID50
W55MID50
Package
Dice form
PDIP-20
SOP-20
Wafer form
Remarks
MOQ required
Winbond Electronics Corp.
7
Revision: A3
Publish Date: 2003/3/24