W25Q40BL_12 Datasheet, PDF (69/74 Pages) Winbond – 2.5V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

8-Pad WSON 6x5-mm Cont’d.
W25Q40BL
SYMBOL
M
N
P
Q
R
MILLIMETERS
Min
Nom Max
Min
SOLDER PATTERN
3.40
4.30
6.00
0.50
0.75
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Max
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. It is recommended to connect the metal pad area on the bottom center of the package to the device ground (GND
pin). Avoid placement of exposed PCB vias under the pad.
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Publication Release Date: May 04, 2012
Revision D