W83L761G Datasheet, PDF (3/16 Pages) Winbond – H/W MONITORING IC

W83L761G Preliminary
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 1
2. FEATURES ................................................................................................................................. 1
3. KEY SPECIFICATIONS .............................................................................................................. 2
4. BLOCK DIAGRAM ...................................................................................................................... 2
5. PIN CONFIGURATION ............................................................................................................... 3
6. PIN DESCRIPTION..................................................................................................................... 3
7. FUNCTIONAL DESCRIPTION.................................................................................................... 4
7.1 General Description ........................................................................................................... 4
7.2 Access Interface ................................................................................................................ 4
7.3 Temperature Measurement Machine ................................................................................ 5
8. CONTROL AND STATUS REGISTER ....................................................................................... 6
8.1 Configuration Register (Write Only)................................................................................... 6
8.2 Temperature Register Return Format (Read at Normal Mode, Read Only) ..................... 6
8.3 Manufacturer’s / Device ID Register Return Format (Read at Power-Down Mode, Read Only) .. 6
9. ELECTRICAL CHARACTERISTIC ............................................................................................. 7
9.1 Absolute Maximum Ratings ............................................................................................... 7
9.2 DC Characteristics............................................................................................................. 7
9.3 AC Characteristics ............................................................................................................. 7
10. THE TOP MARKING................................................................................................................... 9
11. PACKAGE SPECIFICATION .................................................................................................... 10
12. APPLICATION CIRCUITS ........................................................................................................ 11
Publication Release Date: April 18, 2005
-I-
Revision 1.0