ISD4004 Datasheet, PDF (25/28 Pages) Winbond – Single-Chip Voice Record/Playback Devices 8-, 10-, 12-, and 16-Minute Durations

ISD4004 Series
Figure 15: ISD4004 Series Bonding Physical Layout¹ (Unpackaged Die)
ISD4004 Series
I. Die Dimensions
X: 4230 microns
Y: 9780 microns
II.
(3)
Die Thickness
11.5 ±0.5 mils
III. Pad Opening (min)
90 x 90 microns
3.5 x 3.5 mils
V_SSD2
V_SSD1
MOSI SCLK V_CCD2 INT
MISO SS V_CCD1 XCLK
RAC
V_SSA
ISD4004
(2)
V_SSA
V_SSA
AUD OUT
ANA IN–
(2)
V_CCA
AM CAP
ANA IN+
1. The backside of die is internally connected to V_SS. It MUST NOT be connected to any other potential or damage
may occur.
2. Double bond recommended.
3. This figure reflects the current die thickness. Please contact ISD as this thickness may change in the future.
ISD
21