ISD1810 Datasheet, PDF (15/18 Pages) Winbond – Single-Chip, Single-Message Voice Record/Playback Device 8- to 16-Second Durations

ISD1810 Product
Figure 10: ISD1810 Bonding Physical Layout (Unpackaged Die)
ISD1810
I. Die Dimensions
X: 2530
Y: 2420
PLAYL PLAYE REC VSSD RECLED VCCD XCLK FT
I.
2
Die Thickness
11.5 ±0.5 mil (typ)
I. PAD Opening
90 x 90 microns
ISD1810
MIC MICREF AGC SP– VSSA SP+ VCCA ROSC
1. The backside of die is internally connected to V_SS. It MUST NOT be connected to any other potential or damage
may occur.
2. Die thickness is subject to change, please contact ISD factory for status and availability.
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Voice Solutions in Silicon^™