W55RFS27T1B Datasheet, PDF (1/17 Pages) Winbond – SUPER-REGENERATION RF TRANSMITTER

W55RFS27T1B Data Sheet
SUPER-REGENERATION RF TRANSMITTER
Table of Contents-
1. GENERAL DESCRIPTION .................................................................................................................. 2
1.1 Features ..................................................................................................................................... 2
1.2 W55RFS27T1B Pad Definition................................................................................................... 3
1.2.1 Pad Description...........................................................................................................................3
1.2.2 Clock Frequency Select (CKSEL) Setup.....................................................................................3
1.2.3 uC-Mode & Manual Mode (Baseband Data Rate) Setup ............................................................4
1.2.4 Baseband Encoder Control Function Description .......................................................................4
2. SYSTEM DESCRIPTION..................................................................................................................... 5
2.1 W55RFS27T1B System Block Diagram .................................................................................... 5
2.2 W55RFS27T1B Functional Description ..................................................................................... 6
3. ELECTRONIC CHARACTERISTICS................................................................................................... 7
3.1 W55RFS27T1B Absolute Maximum Ratings ............................................................................. 7
3.2 W55RFS27T1B DC Characteristics........................................................................................... 7
3.3 W55RFS27T1B Ordering Information........................................................................................ 8
3.4 W55RFS27T1B Package Information........................................................................................ 8
3.4.1 Bonding Pad List .........................................................................................................................8
3.4.2 Bonding Pad Diagram .................................................................................................................9
4. DESIGN INFORMATION ................................................................................................................... 10
4.1 W55RFS27T1B Reference Design .......................................................................................... 10
4.1.1 TXOUT waveform .....................................................................................................................10
4.1.2 Application Circuit for 6 Control Functions ................................................................................11
4.1.3 Application Circuit for 4 Control Functions ................................................................................12
4.1.4 Application Circuit for FCC........................................................................................................14
4.2 uC-Mode Control Signal........................................................................................................... 15
4.3 W55RFS27T Family FCC Certification .................................................................................... 16
5. REVISION HISTORY......................................................................................................................... 17
Publication Release Date:May 24, 2005
-1-
Revision A3