W28F641B Datasheet, PDF (1/31 Pages) Winbond – 64MBIT (4MBIT × 16) PAGE MODE DUAL WORK FLASH MEMORY

W28F641B/T
64MBIT (4MBIT × 16)
PAGE MODE DUAL WORK FLASH MEMORY
Table of Contents-
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. PIN CONFIGURATION ....................................................................................................................... 3
4. ELECTRICAL CHARACTERISTICS ................................................................................................. 16
Absolute Maximum Ratings* ............................................................................................................ 16
Operating Conditions ........................................................................................................................ 16
Capacitance⁽¹⁾.................................................................................................................................. 17
AC Input/Output Test Conditions...................................................................................................... 17
DC Characteristics............................................................................................................................ 18
AC Characteristics - Read-only Operations(1) ................................................................................. 20
AC Characteristics - Write Operations^{(1, 2)}...................................................................................... 23
Reset Operations.............................................................................................................................. 25
Reset AC Specifications ................................................................................................................... 25
Block Erase, Full Chip Erase, (Page Buffer) Program and OTP Program Performance⁽³⁾ ............. 26
5. ADDITIONAL INFORMATION........................................................................................................... 27
Recommended Operating Conditions .............................................................................................. 27
At Device Power-Up ................................................................................................................... 27
Glitch Noises .............................................................................................................................. 28
6. ORDERING INFORMATION............................................................................................................. 29
7. PACKAGE DIMENSIONS ................................................................................................................. 30
48-pin Standard Thin Small Outline Package (measured in millimeters)......................................... 30
48-ball TFBGA (8 mm x 11 mm) (measurements in millimeters) ..................................................... 30
8. VERSION HISTORY ......................................................................................................................... 31
Publication Release Date: March 27, 2003
-1-
Revision A3