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SE2301 Datasheet, PDF (1/4 Pages) WILLAS ELECTRONIC CORP – SOT-23 Plastic-Encapsulate MOSFETS
WILLAS
S1O.0ATS-U2R3FAPClEaMsOtUicNT-ESCnHcOaTTpKsYuBAlaRRteIERMROECSTIFFIEERTS S-20V- 200V
SOD-123+ PACKAGE
FM120-M+
SE2301THRU
FM1200-M+
Pb Free Product
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
P-Ch•• aHHniiggnhhescluu2rrgr0ee-nVct a(cDpaap-bSaibl)iitlyMit.yO, loSwFfEorTward voltage drop.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
FEAT• USiRlicEon epitaxial planar chip, metal silicon junction.
T•reLMneIcaLhd-S-FfTrEeDeT-1pP9a5ort0ws0me/2re2eM8t eOnSviFroEnmTental standards of
• RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Mechanical data
APPLICATIONS
• Epoxy : UL94-V0 rated flame retardant
zL• oCaadseS: wMiotlcdhedfoprlaPstoicr,taSbOlDe-1D2e3vHices
z
D• TCe/rDmCinaClso:nPvlaetertdetrerminals,
so
lderable
per
MIL
,
-STD-750
z Pb-Free paMcekthaogde20is26available
R• PooHlaSritpyr:oIndduiccattfeodrbpyaccakthinodgecboadnde suffix ”G”
H• MaloougnetinngfPreoesitpiorno:dAuncyt for packing code suffix “H”
• Weight : Approximated 0.011 gram
Package outline
SOD-123H
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
SOT-23
0.071(1.8)
0.056(1.4)
0.031(0.8) Typ.
1. GATE
2. SOURCE
3. DRAIN
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
MARKING:MSA1 XIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
RATINGS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UN
Marking Code
Maximum Recurrent Peak Reverse Voltage
12
13
14
15
16
VRRM
20
30
40
50
60
18
10
115 120
80
100
150
200 Vol
Maximum RMS Voltage
VRMS
14
21
28
35
42
56
70
105
140 Vol
Maximum DC Blocking Voltage
VDC
20
30
40
50
60
80
100
150
200 Vol
MaximumMAavexriamgeuFmorwraardtiRnegctsifie(dTCau=rr2e5nt℃ unlessIOotherwise noted)
1.0
Am
Peak Forward Surge Current 8.3 mPs sainrgalme heatlfesrine-wave IFSM
Symbol
Value 30
Unit
Am
superimposed on rated load (JEDEC method)
Typical ThDerraminal-SReosuisrctaencVeo(lNtaogtee2)
Typical JuGnacttieon-SCoaupracceitaVncoelta(Ngoete 1)
Operating Temperature Range
Storage TCeomnpteinrautuoruesRDanrgaein Current
Pulsed Drain Current
RΘJA
CJ
TJ
TSTG
VDS
VGS
-55 to +125
ID
IDM
-20 40
±8 120
-2.3- 65 to +175
-10
V
-55 to +150
A
℃/W
PF
℃
℃
ContinuouCsHASRoAuCrcTeE-RDISraTiInCSDiode CurrenStYMBOL FM120-MH FMIS130-MH FM140-MH FM150-M-0H.F7M2160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UN
Maximum Forward Voltage at 1.0A DC
VF
0.50
0.70
0.85
0.9
0.92 Vol
Maximum Power Dissipation
Maximum Average
Rated DCTBhleorcmkinagl
Reverse Current at
VRoeltsaigsetance from
@T A=25℃
J@uTnAc=ti1o2n5℃to
AmbIRient(t
≤5s)
PD
R θJA
0.35 0.5
357 10
W
℃/W
mAm
Junction Temperature
NOTES:
TJ
1- MeasureSdtoatra1gMeHZTeanmdpaeppralietdurreeverse voltage of 4.0 VDC.
Tstg
150
-55 ~+150
℃
2- Thermal Resistance From Junction to Ambient
2012-06
2012-10
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.