2N7002LT1 Datasheet, PDF (1/4 Pages) Motorola, Inc – CASE 318-08, STYLE 21 SOT-23 (TO-236AB)

WILLAS
Sm_1.0a_All_SUS_Ri_Fg_An_Ca_El_MM_OUO_NTS_SF_CE_HT_OTT1_K1_Y5_BAm_RRA_IEm_{R R}p_Es_CT, _IF6_IE0_RV_{S -}o₂₀l_Vts_{- 200V}
SOD-123+ PACKAGE
FM120-M+
2N7002LTT1HRU
FM1200-M+
Pb Free Product
Features
Package outline
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
N–• CLohw paronfinleesulrfSacOe mTo–un2te3d application in order to
optimize board space.
SOD-123H
3
•
• Low power loss, high efficiency.
•^WH^eig^dh^ec^cu^larr^re^en^tt^hc^aa^tp^tha^ebil^mity^a,^telo^rw^ialfo^or^fw^pa^rr^od^dv^uo^cl^tta^ag^ree
Halogen
drop.
Free
and
•^coH^mig^ph^lis^auⁿr^cg^ee ^wca^itp^ha^Rbi^oli^Hty^S. ^{requirements.}
• •EGSuDarPdrriontgefcotreodv:1er0v0o0ltVage protection.
0.146(3.7)
0.130(3.3)
1
2
0.012(0.3) Typ.
• ^•P^Ub^lt-^rF^ar^heⁱe^ghp^-sa^pc^ek^ea^dg^se^wii^ts^chaⁱⁿv^ga^. ilable
• Silicon epitaxial planar chip, metal silicon junction.
•^RL^oe^Had^S-fr^pe^re^op^da^ur^cts^t
for packing code suffix ”G”
meet environmental standards
of
SOT–
23
0.071(1.8)
0.056(1.4)
H^Ma^Il^Lo^-g^Se^Tn^D-f¹re⁹e⁵⁰p⁰r^/o²d²u⁸ct for packing code suffix “H”
• RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
MAXIMUM RATINGS
• Case : Molded plastic, SOD-123H
Rating
Symbol Value, Unit
• Terminals :Plated terminals, solderable per MIL-STD-750
Drain–Source Voltage
Method 2026
V_DSS
60
Vdc
0.031(0.8) Typ.
Simplified Sch0e.0m40a(1.t0i)c
0.024(0.6)
Gate 1
0.031(0.8) Typ.
•^DP^raoⁱⁿla^–r^Git^ay^te: I^Vn^od^li^tc^aa^gt^ee⁽d^RbGyS c⁼a¹th^.0o^Mde^Ωb⁾ and
V_DGR
60
Vdc
Dimensions in inches and (millimeters)
•^DM^raoⁱⁿun^Ct^uin^rrg^enP^tosition : Any
I_D
±115 ^mAdc
•
– Continuous T_C = 25°C (Note 1.)
W_–e_Cig_oh_nt_tin: A_uop_up_sro_Tx_Cim_{= 1}a₀te₀d_°C0.₍0_N1_o1_teg₁r_.a₎m
I_D
±75
I_DM
±800
– Pulsed (Note 2.)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Gate–Source Voltage
Ratings at_–2_C5℃_ontia_nm_uob_uie_snt temperature unless otherwise_Vs_Gp_Secified. _±20
Vdc
Single pha–sNe ohna–lfrewpaevteit,iv6e0(Htpz,≤re5s0isµtsiv)e of inductive loaVd_G._SM
±40
Vpk
3 Drain
Source 2
(Top View)
For capacitive load, derate current by 20%
RATINGS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Marking Code
12
13
14
15
16
18
10
115 120
Maximum Recurrent Peak Reverse Voltage
VRRM
20
30
40
50
60
80
100
150
200 Volts
Maximum_TR_HM_ES_RV_Mo_Alta_Lge_{CHARACTERISTICS}
Maximum DC Blocking V_Co_hlta_ag_rae_cteristic
VRMS
14
21
28
35
V_SDC_ymbol 20 _Max 30 _Unit 40
50
42
56
70
105
60 ^M&APR8_IN0^KIANSGSDIG1^I0^AN0^GMREANMT 150
140 ^Volts
200 ^Volts
Maximum _TA_ov_te_ar_la_Dge_evF_ico_erw_Da_ir_sd_sR_ipe_ac_tt_ioifi_ned_FRCu_–r₅re_Bn_ot _ard
Peak Forward^(NS^our^tg^ee³C^.)u^TrrAen⁼t 8².⁵3^°m^Cs single half sine-wave
Derate above 25°C
IO _PD
IFSM
225
mW
1.8 mW/°C
1.0
Drain
30
3
Amps
Amps
superimposed on rated load (JEDEC method)
Typical Th^Te^hrm^era^ml R^ae^l s^Ris^et^saⁱn^sc^taeⁿ(^cN^eo^,te^Ju2ⁿ)^{ction to Ambient}
Typical Ju_Tn_octi_ao_ln_DC_ea_vp_ica_eci_Dta_in_sc_se_ip(_aN_to_iot_ne 1)
Operating TeAmlupmeriantaurSeuRbasntrgaete,(Note 4.) TA = 25°C
Storage Tem^Dp^eer^ra^at^tu^ere^abR^oa^vn^ege^25°C
RΘJ^RAθJA
CJ _PD
TJ
TSTG
556 °C/W
300
mW
-55 to _m+1_W25_/°C
2.4
40
120
1
- 65 to _G+_a1_t7_e5
702
-55 to +150
2
Source
℃/W
PF
℃
℃
Thermal Resistance, Junction to Ambient
Junction a^Cn^Hd^AS^Rt^Ao^Cra^Tg^Ee^RT^Ie^Sm^TIp^Ce^Srature
Maximum Forward Voltage at 1.0A DC
R_θJA
417 °C/W
702 = Device Code
SY_VM_TFB_J,O_TL_stgFM120-M_-+51H₅₅F_t0M_o 130-M₀H_°.C5F₀M140-MH
FM150-MH FM160-MH
0.70
FM_W180-MH F₌M_M1_o10_n0_t-_hM_CH_oF_dM_e1150-MH
0.85
0.9
FM1200-MH
0.92
UNIT
Volts
Maximum
Rated D¹C^.
Average Reverse Current at @T A=25℃
B^Tlo^hc^eki^Png^owV^eo^rlt^Dag^ise^{sipation of the}@^pT^aA^c=^k1^a2^g5^e℃^may
re^Is^Rult
in
a
lower
continuous
drain
0.5
10
current.
mAmps
NOTES: ^{2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.}
1- Measu³⁴re^.. d^FAa^Rlt_u1^–m5M_inH^=aZ¹⁼a^.0n₀d^x.4a⁰p_x.p⁷⁰l⁵ie_.3d^x _xr⁰e^.0v⁰e_.60rs²²e_5inv_io^.nlta₉g₉e_.5o_%f 4_a.0_luV_mD_iC_n._a.
ORDERING INFORMATION
2- Thermal Resistance From Junction to Ambient
Device
Marking
Shipping
2N7002LT1
702
3000 Tape & Reel
2012-06
2012-10
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.