AO4447A Datasheet, PDF (2/5 Pages) Alpha & Omega Semiconductors – 30V P-Channel MOSFET

AO4447A
Electrical Characteristics (T_J=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BV_DSS Drain-Source Breakdown Voltage
I_D =-250µA, V_GS = 0V
-30
V
I_DSS
Zero Gate Voltage Drain Current
V_DS =-30V, V_GS = 0V
T_J = 55°C
-1
µA
-5
I_GSS
Gate-Body leakage current
V_DS = 0V, V_GS =±16V
±10 µA
V_GS(th) Gate Threshold Voltage
V_DS =V_GS I_D =-250µA
-0.8 -1.3 -1.6 V
I_D(ON)
On state drain current
V_GS =-10V, V_DS =-5V
-160
A
V_GS =-10V, I_D =-17A
5.5
7
R_DS(ON) Static Drain-Source On-Resistance
T_J=125°C
V_GS =-4.5V, I_D =-15A
7
8.5
6.5
8
mΩ
V_GS =-4V, I_D =-13A
6.9
9
g_FS
Forward Transconductance
V_DS =-5V, I_D =-17A
70
S
V_SD
Diode Forward Voltage
I_S =-1A,V_GS = 0V
-0.62 -1
V
I_S
Maximum Body-Diode Continuous Current
-3
A
DYNAMIC PARAMETERS
C_iss
Input Capacitance
C_oss
Output Capacitance
C_rss
Reverse Transfer Capacitance
R_g
Gate resistance
V_GS=0V, V_DS=-15V, f=1MHz
V_GS=0V, V_DS=0V, f=1MHz
4580 5500 pF
755
pF
564
pF
160 210 Ω
SWITCHING PARAMETERS
Q_g (-10V) Total Gate Charge
Q_g (-4.5V) Total Gate Charge
Q_gs
Gate Source Charge
V_GS=-10V, V_DS=-15V, I_D=-17A
Q_gd
Gate Drain Charge
t_D(on)
Turn-On DelayTime
t_r
Turn-On Rise Time
V_GS=-10V, V_DS=-15V
t_D(off)
Turn-Off DelayTime
R_L=-0.9Ω, R_GEN=3Ω
t_f
Turn-Off Fall Time
t_rr
Body Diode Reverse Recovery Time ^IF^{=-17A, dI/dt=300A/µs}
Q_rr
Body Diode Reverse Recovery Charge ^IF^{=-17A, dI/dt=300A/µs}
87 105 nC
41
nC
12.8
nC
17
nC
180
ns
260
ns
1.2
µs
9.7
µs
32
40
ns
77
nC
A: The value of R_θJA is measured with the device mounted on 1in² FR-4 board with 2oz. Copper, in a still air environment with T_A =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation P_D is based on T_J(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T_J(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initial T_J =25°C.
D. The R_θJA is the sum of the thermal impedence from junction to lead R_θJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in² FR-4 board #wRithEF!
2oz. Copper, assuming a maximum junction temperature of T_J(MAX)=150°C. The SOA curve provides a single pulse rating.
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev.2.0: June 2013
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