B120F Datasheet, PDF (5/6 Pages) NEC – The flexible blade server

B120F thru B1200F
5.Suggested thermal profile for soldering process
1. Storage environment：Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time(min to max)(ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time(tL)
Peak Temperature(TP)
Time within 5℃ of actual Peak
Temperature(TP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Soldering Condition
<3℃/sec
150℃
200℃
60~120sec
<3sec
217℃
60-260sec
255 -0/+5℃
10~30sec
<6℃/sec
<6minutes
WEITRON
5/6
http://www.weitron.com.tw
28-May-2016