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ESDB0501B2C Datasheet, PDF (2/2 Pages) Weitron Technology – Surface Mount TVS For ESD Protection Diode
ESDB0501B2C
Maximum Ratings (TA=25°C unless otherwise noted)
Parameter
Symbol
Limits
IEC61000−4−2(ESD)
Air/ Contact
±30
ESD voltage
per human body model
16
Per machine model
400
Total power dissipation on FR-5 board (Note 1)
PD
100
Thermal Resistance Junction−to−Ambient
RθJA
1250
Lead Solder Temperature − Maximum (10 Second Duration)
TL
260
Junction and Storage temperature range
Tj, Tstg
-55 ~ +150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only.
Functional operation above the Recommended. Operating Conditions is not implied. Extended exposure to
stresses above the Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
Unit
KV
KV
V
mW
℃/W
℃
℃
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
Working Peak Reverse Voltage
IR
Maximum Reverse Leakage Current @ VRWM
VBR
Breakdown Voltage @ IT
IT
Test Current
C
Max. Capacitance @VR=0 and f =1MHz
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Device
Device
Marking
VRWM
(V)
Max
IR (μA)
@ VRWM
Max
VBR (V) @ IT
(Note 2)
Min Max
VC
IT
@IPP = 5 A
mA
V
DTESDB5V0LED02
EB
5.0
1.0
5.8 7.8 1.0
10
2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C.
IPP(A)
Max
11.2
VC (V)
@Max IPP
Max
12.5
C (pF)
Max
30
WEITRON
http://www.weitron.com.tw
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15-Apr-09